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Работа в Киеве (офшор)

Role

Provide thermal, mechanical, and thermo-mechanical design and analysis services for IC package and system level physical designs. The successful candidate will join a dedicated team brining thermo-mechanical design application notes and custom solutions for high performance analog and mixed signal SOCs in telco, enterprise, and high-end consumer applications. The ideal candidate will provide thermal design solutions such as desired air flow, size, proximity of components, and PCB layer count specifications, and heat sinks.

Skills/Experience

-3+ years experience in advanced package or PCB level thermal or mechanical design, analysis, and implementation.

-The candidate should have broad experience with finite element analysis (FEA) and computational fluid dynamics (CFD) solution processes applied to complex 3D Si, package, socket, connector, and PCB structures.

-Experience in solving steady state and dynamic thermal problems and / or experience is solving linear and non-linear mechanical system problems to predict life time reliability is required.

-Knowledge of IC package and PCB materials, failure analysis, test sockets, and connectors desired

-Working knowledge of solder joint reliability, pb-free, and green packaging surface mount technologies desired.

-Tools knowledge needed: Autocad, Ansys, Flowtherm or Icepak

-Tools knowledge desired: Pro-E, Cadence Allegro/APD, Abaqus

Additional Skills

The position will require continuous communication between the development teams in the US and the technology transfer and manufacturing partners in US, Europe, and Asia. Excellent communication skills and fluency in English are a must, while fluency in Mandarin, Korean or Japanese is a plus. Travel to the technology transfer and manufacturing partners facilities may also be required.

Education Requirements

The successful candidate must have a BS/MS degree or equivalent in mechanical engineering or materials science with strong mathematical and programming background. is a must. Minimum of 10 years of related experience in a product oriented company is required.

 

Резюме - на eugene.krashtan(at)mindspeed.com

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Кстати, ембеддеры со знанием АРМ тоже нужны. Резюме на eugene.krashtan(at)mindspeed.com

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